Date : 09-Dec-2020
Location: Malaysia
Organization:
Vertiv, a global provider of critical digital infrastructure and continuity solutions.
Key Takeaways:
- Vertiv has been ranked by technology analyst firm Omdia as the largest global supplier in a data center cooling market which continues to undergo change and innovation.
- The newly released research highlights that established heat rejection technologies such as Direct Expansion (DX), Chilled Water and Evaporative Cooling continue to dominate while also becoming more sustainable.
Offering:
- In addition to analysing market position, the report provides insight and intelligence on how data center cooling technology is evolving.
- In Asia, Vertiv has launched several thermal management solutions, including the Liebert® CRV4, a row-based solution designed to provide maximum cooling in a compact design; the Liebert PEX4 room cooling solution with integrated intelligent controls and the latest technologies for maximum efficiency.
Spokepersons:
Lucas Beran, principal analyst for Omdia’s cloud and data center research practice and the report’s author, said,this is an exciting time for data center thermal management market as proliferation of innovations and products are coming out to solve the problems of heat issues from high-density deployments,such as the 10kW+ rack densities.
Insights:
- The Omdia paper, Data Center Thermal Management Report 2020, published in late 2020 and based on 2018 and 2019 data, states that Vertiv has a 23.5% share of the global data center cooling market – more than 10% higher than its nearest rival.
- In addition, new technologies, such as forms of liquid cooling, are predicted to grow as data center operators look for ways to further improve efficiency and deal with increasingly power-intensive compute.
- In addition to internal innovations, Vertiv is also working with industry thought leadership groups and recently became a Platinum Member of the Open Compute Project (OCP).
- According to Omdia, split DX is still the primary form of heat rejection in data center thermal management, but chilled water and direct evaporative heat rejection are gaining momentum. In addition, cloud and colocation service provider momentum has accelerated, driving double-digit growth for air handling units (AHU).
- Omdia predicts there will also be strong growth in forms of liquid cooling – immersion and direct-to-chip – that are expected to double between 2020 and 2024. Several factors are contributing to this shift, including increasing chip and server power consumption, edge growth, increasing rack densities, as well as energy efficiency and sustainability requirements.
Editor's comments:
The conclusion is that the industry is looking forward to liquid cooling – immersion and direct-to-chip - to efficiently mitigate growing heats in the data centres.
Vertiv Adiabatic Freecooling Chiller Innovation Lab |
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